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Best CPU Cooler Performance LGA1366 Q3-2009 E-mail
Reviews - Featured Reviews: Cooling
Written by Olin Coles   
Friday, 09 October 2009
Table of Contents: Page Index
Best CPU Cooler Performance LGA1366 Q3-2009
Thermally Conductive Element Reference
Cogage TRUE Spirit
CoolAge CA-X120TF Wind Tunnel
Corsair H50 CWCH50
Scythe Kabuto SCKBT-1000
Scythe Mugen 2 SCMG-2000
Tuniq Tower-120 Extreme
ZEROtherm Nirvana NV120 PWM Premium
Cooler Surface Preparations
Cooler Test Methodology
Test Results: Stock Cooling Fan
Test Results: High-Output Fan
Enthusiast Fan Comparison
CPU Cooler Final Thoughts
Best CPU Cooler Conclusion

CPU Cooler Final Thoughts

It was around Q3-2008 when the final tests were conducted for the last LGA775 Socket-T Best CPU Cooler Performance article, and in many ways this Q3-2009 article could be repeating the same outcome. The recent launch of Intel's Core i5 series for the LGA1156 socket has really shaken the market. We tested the Intel Core i7-870 LGA1156 processor directly against the LGA1366 Core i7-920 in our P55 vs X58-Express platform comparison, and the P55 really dealt a lethal blow to overpriced 'enthusiast-designated' hardware. Perhaps a future Best CPU Cooler Performance article will feature coolers for the AMD AM3 platform, with their unlocked and ultra-affordable Black Edition Phenom-II processor series. Anything could happen, and we'd like to hear your feedback.

There is one minor drawback to using the Core i7 or Phenom II processors which affects overclockers: the difference in CPU cooler mounting dimensions. Many overclockers and enthusiasts have grown to cherish their favorite cooler, and trust them to cool the hottest system they can build. The problem is that now many manufacturers are offering free adapter kits, or include an adapter with their current model coolers, which leads to bigger problems because of processor differences. For all of our LGA1366 test products, we used the Xigmatek ACK-I7361 or ACK-I7363 CrossBow mounting kits whenever possible.

CPU coolers made for the LGA775 platform are designed for use with a Core 2 (Duo or Quad) or Pentium 4 and D processor with an integrated heat-spreader measuring 28.5 x 28.5mm (812.25mm total area), but the LGA1366 socket requires a much larger 32 x 35mm (1120mm total area) footprint to accommodate the extra 591 'pins'. Then there's the LGA1156 socket, which measure 30mm square for 900mm of area. If you use an LGA775 or LGA1156 cooler on a LGA1366 socket, your missing out on up to 38% (307.75mm) of the contact surface. Additionally, the cores are located in slightly difference locations; the Core 2 Quad is slightly spaced away from the center, while the Core i7 is concentrated there.


The Phenom II processor series from AMD offer a very large 37.31 x 37.31mm (1392.04mm total area) integrated heat-spreader surface, which is the largest processor surface I can recall since the original Intel Pentium (I) days. Compared to Intel's Core 2 Duo and Quad processors which measure 28.5 x 28.5mm, the Phenom II offers over 71% more contact surface area. If you compare the latest Intel Core i7 processors which measure 32 x 35mm, then the Phenom II series offers 24% more contact surface area. For overclockers, this will mean a much larger area to cool, but also much more manageable temperatures.

There are a lot of different products out there, and believe it or not we exclude a few from each article because they don't stack up well at all. So this is why you may not see some of the coolers other sites have tested in our results. Because of space and time limitations it's just simply not feasible to review them all, but it's certainly worth mentioning which products should be avoided. So I began to carefully think about it and nearly constructed a real-time chart which places products into different levels of performance. That's when I realized that performance is relative, too, and what performs well today might be considered low-end only a year from now. Perhaps the best method for testing is to use a synthetic system to generate the same exact load for each and every test conducted. This would stand the test of time much better than any computer system or processor platform would, because temperature is a static measurement, but it wouldn't take into account the differences seen between processor model architecture.

The synthetic test unit might generate 250W of thermal energy, but every CPU series has a different layout and might not mate perfectly to a particular cooler. This brings me to my final point: there's a cooler for every processor and purpose. The ordinary casual computer user is fine with the included thermal cooling solution that comes with the retail processor kit. Systems built with a Core 2 Duo processor and three-piped HDT cooler (like the HDT-S1283 or Vendetta 2) will not be cooled the same as a Core 2 Quad processor because of where the cores align with the heat-pipes. Likewise, coolers built around the Core 2 LGA775 design may not perform well at all with the Core i7 or Phenom II platforms. This is why the research is so critical, and understanding the product is important.



# March 11th cooler article?Hugo Martinez 2010-03-11 22:26
Where I am, it's March 12th. I've been looking forward to your March 11th "Q1-2010 Best CPU Cooler Performance LGA1366" article that was scheduled for March 11th. Is it already up but I'm too blind to find it? Or are you running late?

I need to buy a cooler but I promised myself to wait until I read the report.

Report Comment
# Worth the waitOlin Coles 2010-03-12 07:39
Hello Mr. Martinez:

This article has grown much larger than first planned, and is expected to be published later this afternoon (3/12). It's worth the wait! :)
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# Hope it is worth the waitRaul Tano 2010-03-12 15:40
I'm in the same boat as Mr. Martinez. I eagerly await the article.
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# DiamondsJava_Az 2010-05-24 10:43
although Diamond is a polymorph of the element carbon.Diamond conducts heat better than anything - five times better than the second best element, Silver! I wonder what a diamond heatsink would set you back
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# MikeMichael 2010-09-26 09:34
Diamond only conducts heat in such a manner when it's aligned properly - therefore, you must grow a diamond, or fashion a diamond into a heatsink - you cannot combine diamonds as they would not match in alignment on the molecular level. This means you would need to start with a massive diamond.
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# wrong specificationjason 2010-08-10 13:19
Editors, can you correct the weight in the above specifications?
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# RE: wrong specificationOlin Coles 2010-08-10 13:20
Be more specific, and list your source.
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# RE: wrong specificationsjason 2010-08-12 01:41

SCMG-2000 Specifications
Weight: 870 g
30.7 lb

It should be 30.7oz.
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# RE: wrong specificationsjason 2010-08-11 11:08
Sorry I was talking about the specifications of SCMG-2000.
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# Can Mugen 2 fit in ThermaltakeV3 BE or Cooler Master 430 elite?Deen 2011-02-26 12:52
Can Mugen 2 fit in ThermaltakeV3 BE or Cooler Master 430 elite?
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