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AMD Phenom II X4 940 Black Edition CPU HDZ940XCGIBOX E-mail
Reviews - Featured Reviews: Processors
Written by Olin Coles   
Wednesday, 11 February 2009
Table of Contents: Page Index
AMD Phenom II X4 940 Black Edition CPU HDZ940XCGIBOX
Features and Specifications
Closer Look: Phenom II X4 940BE
Testing and Results
Devil May Cry 4 Gaming
EVEREST Benchmark Tests
Far Cry 2 Gaming
Passmark PerformanceTest
PCMark05 Benchmark Tests
SPECperfview CATIA Tests
AMD Dragon Final Thoughts
Phenom II X4 940BE Conclusion

Phenom II X4 940BE Features

Major feature enhancements for 45nm AMD Phenom II:

  • Enhanced Total Cache: 8MB (L2 + L3)
  • Cool'n'Quiet 3.0 Technology: Additional power states, significantly (~40%) lower idle power and lower power consumption under moderate loads
  • Increased frequency: AMD Phenom II 940 3.0GHz @ 125W TDP
  • Massive headroom using extreme and experimental cooling techniques

Major silicon enhancements for 45nm AMD Phenom II:AMD_Phenom_II_X4_Logo.jpg

  • 45nm immersion lithography manufacturing technology enables higher frequencies, tighter tolerances and lower current leakage
  • 6MB L3 cache (up from 65nm Phenom's 2MB)
  • 2-cycles faster than 65nm Phenom L3
  • Increased DRAM bandwidth
  • Cache flush on halt: Core's L1 and L2 flush into shared L3 after a core enters a halt state allowing the core to drop to a lower speed and save power
  • Path-based indirect branch prediction
  • 2x increase in core probe bandwidth
  • Larger load/store buffering / larger floating point buffering / reduced MAB (missed buffer) lifetime
  • Improved LOCK pipelineing: (LOCK is an instruction prefix) this improves performance when multiple LOCKS are in process simultaneously
  • FP MOV compute optimization: Floating point register-to-register move instruction improvements

HDZ940XCGIBOX Specifications

  • Processor Frequency: X4 940 (Black Edition) = 3.0GHz
  • L1 Cache Sizes: 64K of L1 instruction and 64K of L1 data cache per core (512KB total L1 per processor)
  • L2 Cache Sizes: 512KB of L2 data cache per core (2MB total L2 per processor)
  • L3 Cache Size: 6MB (shared)
  • Memory Controller Type: Integrated 128-bit wide memory controller (configurable for dual 64-bit channels for simultaneous read/writes)
  • Memory Controller Speed: Up to 1.8GHz with Dual Dynamic Power Management
  • Types of Memory Supported: Support for unregistered DIMMs up to PC2 8500 (DDR2-1066MHz)
  • Memory Bandwidth: Up to 17.1GB
  • HyperTransport 3.0 Link: One 16-bit/16-bit link @ up to 3.6GHz full duplex (1.8GHz x2)
  • HyperTransport 3.0 Bandwidth: Up to 14.4GB/s
  • Total Processor Bandwidth: Up to 31.5 GB/s total bandwidth
  • Packaging: Socket AM2+ 940-pin organic micro pin grid array (micro-PGA)
  • Fab location: Fab 36 wafer fabrication facilities in Dresden, Germany
  • Process Technology: 45-nanometer DSL SOI (silicon-on-insulator) technology
  • Approximate Transistor count: ~ 758 million (45nm)
  • Approximate Die Size: 258 mm2 (45nm)
  • Max Ambient Case Temp: 62o Celsius
  • Nominal Voltage: 0.875 - 1.5 Volts
  • Max TDP: 125 Watts



 

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