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Best CPU Cooler Performance - Q1 2008 E-mail
Reviews - Featured Reviews: Cooling
Written by Olin Coles   
Tuesday, 08 April 2008
Table of Contents: Page Index
Best CPU Cooler Performance - Q1 2008
Thermally Conductive Element Reference
Kingwin RVT-12025
Xigmatek Red Scorpion S1283
Kingwin RVT-12025D
Noctua NH-U12P
OCZ Vendetta 2
Thermalright Ultra-120 eXtreme
TIM Application and Surface
Testing Methodology
CPU Cooler Test Results
Final Thoughts and Conclusion

OCZ Vendetta 2

OCZ Completely surprised us when the original Vendetta HDT CPU cooler was tested and secured a top position among our collection of coolers. It was later discovered that the loud high-volume 92mm fan was included for a reason: the fins were much longer than the Xigmatek HDT-S963 it was loosely based off of and needed the extra push to force air past them. But OCZ didn't leave well enough alone, and recognized where there could be the potential for even more performance out of the HDT design. So back to the design table they went, and created the OCZ Vendetta 2 HPT CPU Cooler OCZTVEND2.


The OCZ Vendetta 2 is an efficient new CPU cooler that utilizes a distinctive stacked fin design and heat-pipe Direct Touch (HDT) technology. In this version of their popular cooler, OCZ designed the OCZTVEND2 to use large 8-gauge copper heat-pipe rods combined with a large low-noise fan. Together these items match to offer a perfect balance, allowing the Vendetta 2 to quietly cool even the most robust quad-core system.


Utilizing the proven performance of their original Vendetta HTD design, the Vendetta 2 has direct contact with the processor using three copper heat pipes to ensure the most rapid heat transfer and a lighter weight. OCZ's unique dimple micro-configuration of the stacked aluminum fins adds turbulence, reducing the skin effect of laminar air flow for more efficient circulation within your case.

The Vendetta 2 also offers an extra performance boost over the more compact original version. The ultra-quiet 120mm fan comes equipped with anti-vibration rubber latches to reduce excess noise, so high-volume airflow doesn't have to mean high-volume noise like the 92mm version fan.


OCZTVEND2 Specifications

  • For Sockets AMD 754/755/939/AM2 and Intel LGA775
  • 3 Pure Copper heat pipes for superior heat dissipation
  • Pure Aluminum fins for ultimate durability
  • Heatsink Dimensions:(W)120 x (H)50 x (D)159mm
  • Fan Dimensions: (L)120 x (W) 120 x (H)25mm
  • Rated Voltage: 12V DC
  • Fan Speed: 800-1500 RPM
  • Fan Air Flow: 65-81 CFM
  • Noise Level: 20-32 dBA
  • Bearing type: Rifle
  • Connector: 4 pin with PWM
  • Includes: 120mm Fan with rubber connectors
  • Mounting Hardware for all above CPUs

EDITORS NOTE: Because of the fairly dense finsink system on the Vendetta 2, the stock fan (not used in this article) is best suited for noise reduction and not cooling performance. After dozens of re-tests, it's been concluded that a 72-78 CFM fan provides the optimum airflow for this cooler.


As with all HDT coolers, there are small "gutters" to each side of the heat-pipe rod. These gutters are very small, but they are still large enough to collect excess Thermal Interface Material. It's recommended that a carbon and aluminum-oxide based TIM be used with all copper surfaces. There are many excellent options tested in our 33-Way Thermal Interface Material Comparison article.


About the company:ocz_logo_200px.png OCZ Technology

Entering the memory market in August 2000, OCZ Technology was built around the determination to manufacture the best high speed DDR and RDRAM. OCZ was founded by enthusiasts, for enthusiasts, and their commitment to the end-user has not digressed. OCZ Technology has been an innovator in many areas.

We were the first manufacturer to make Dual Channel optimized memory available to the public, which originally took advantage of nVidia's Twinbank or Dual DDR architecture, found in their nForce chipset. We have now taken that technology and tailored it for the Canterwood, and Granite Bay chipset's. OCZ developed and was the first to implement ULN technology, which has been a critical element in the manufacturing process for some time.

We at OCZ diligently work to improve communication with CPU and motherboard chipset manufacturers prior to the release of their products. Only in this manner can we fine-tune the memory's SPD settings, ensuring a synergistic relationship between the memory module, memory controller, and microprocessor. In today's rapidly evolving semiconductor industry, such communication is not simply research, but a necessary component of the manufacturing process.


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