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AMD Phenom II X2 550 BE AM3 Processor E-mail
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Written by Mathew Williams   
Tuesday, 02 June 2009
Table of Contents: Page Index
AMD Phenom II X2 550 BE AM3 Processor
Features and Specifications
Closer Look: Phenom II X2 550 BE
Testing and Results
EVEREST Benchmark Tests
Passmark PerformanceTest
PCMark05 Benchmark Tests
Crysis Gaming
Devil May Cry 4 Gaming
SPECperfview CATIA Tests
Overclocking
Final Thoughts and Conclusion

Phenom II X2 AM3 Black Edition Features

Ready to accelerate
Take performance over the top with AMD PhenomTM II processors and AMD OverDriveTM software. Second generation AMD PhenomTM II processors feature a refined architecture, the award-winning innovation of AMD64 technology with Direct Connect Architecture, and 45nm technology for maximum performance headroom.

Beyond specifications
Tune performance with the superior headroom of AMD PhenomTM II processors and AMD OverDriveTM software. Combined with ATI RadeonTM HD graphics cards, they deliver extreme visual performance and the ability to control and monitor system functions.

Total system performance
Build a total system tuned for performance, beginning with an all-AMD solution including AMD PhenomTM II processors, AMD chipsets, and ATI RadeonTM HD graphics with CrossFireXTM technology for multi-GPU support. Experience the power of gaming beyond high definition.

HDZ550WGIBOX Specifications

  • Model Number & Core Frequency: X2 550 Black Edition = 3.1GHz
  • TRAY OPN# HDZ550WFK2DGI
  • PIB OPN# HDZ550WGIBOX
  • L1 Cache Sizes: 64K of L1 instruction and 64K of L1 data cache per core (256KB total L1 per processor)phenom_II_x2_550_logo.jpg
  • L2 Cache Sizes: 512KB of L2 data cache per core (1MB total L2 per processor)
  • L3 Cache Size: 6MB (shared)
  • Memory Controller Type: Integrated 128-bit wide memory controller *
  • Black Edition processors support software selectable increases to memory controller, HyperTransport, DDR3 and CPU core frequency.
  • Memory Controller Speed: 2.0GHz with Dual Dynamic Power Management
  • Types of Memory Supported: Support for unregistered DIMMs up to PC2-8500 (DDR2-1066MHz) -AND- PC3-10600 (DDR3-1333MHz)
  • HyperTransport 3.0 Specification: One 16-bit/16-bit link @ up to 4.0GHz full duplex (2.0GHz x2)
  • Total Processor-to-System Bandwidth: Up to 37.3GB/s bandwidth [Up to 21.3 GB/s total bandwidth (DDR3-1333) + 16.0GB/s (HT3)]
  • Up to 33.1GB/s bandwidth [Up to 17.1 GB/s total bandwidth (DDR2-1066) + 16.0GB/s (HT3)]
  • Packaging: Socket AM3 938-pin organic micro pin grid array (micro-PGA)
  • Fab location: GLOBALFOUNDRIES Fab 1 Module 1
  • Process Technology: 45-nanometer DSL SOI (silicon-on-insulator) technology
  • Approximate Die Size: 258 mm2
  • Approximate Transistor count: ~ 758 million
  • Max Temp: 70o Celsius
  • Core Voltage: 0.850-1.425V
  • Max TDP: 80 Watts
  • MSRP: $102

*Note: configurable for dual 64-bit channels for simultaneous read/writes



 

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