OCZ Gladiator Max OCZTGLADM

Combining a distinctive stacked fin array, heat-pipe direct touch (HDT) design, and a large low-noise fan, the Gladiator series is built to take on the cooling challenges of today's most powerful processors and ensure your system functions at its peak. Utilizing the proven performance of the latest HDT design, the Gladiator series has direct contact with the processor using four copper heat pipes to ensure the most rapid heat transfer. The unique "folded" fin configuration also helps maximize surface area while maintaining a compact form factor.

Engineered to aggressively dissipate heat produced by high-speed CPUs, the Gladiator series can tackle any challenge in the overclocking arena. These coolers run quiet courtesy of a large fan mounted with anti-vibration rubber connectors to reduce excess noise, perfect for a media center or office desktop where silence is a top priority. The versatile and user-friendly Gladiator series is compatible with AMD AM2/939/754/755 and Intel 775 sockets and can be installed quickly and easily by end-users at all skill levels.

Almost everyone involved in the overclocking community is acutely aware of OCZ's Vendetta 2 OCZTVEND2 CPU cooler. OCZ Has once again done phenomenal job of taking Heat-pipe Direct Touch (HDT) technology and building it into their own design. Dubbed the "Gladiator Max" OCZTGLADM, OCZ introduces two new sizes (120mm for Gladiator Max, 92mm for Gladiator) for enthusiasts on a budget.

The OCZTGLADM model comes with a low-noise 120mm cooling fan attached to a large "M" shaped finsink array. Four 8mm copper heat-pipe rods assembled in a staggered pattern travel to the top of the Gladiator Max using a conventional "U" design. Benchmark Reviews first observed this design in the Xigmatek Achilles S1284, and OCZ offers a slightly-tweaked version in this new cooler.

To the dismay of many hard-core overclockers, OCZ has decided to once again utilize the standard Intel compression clips to secure the Gladiator Max. The mounting pressure is certainly adequate, but more pressure means better performance. Benchmark Reviews utilized the Xigmatek Crossbow ACK-L7753 kit for our tests of the OCZ Gladiator Max cooler, and alternated between the stock cooling unit and the high-output Yate Loon D12SH-12 fan.

At the time of initial product launch, the OCZ Gladiator Max OCZTGLADM is freshly listed at NewEgg for $52.99. Using the Benchmark Reviews price comparison tool, we located other retailers selling the Gladiator Max for less.

OCZTGLADM Specifications

• 4 Pure Copper heat pipes for superior heat dissipation
• Pure Aluminum alloy fins for ultimate durability
• Fan Specs:
  • Size: 120mm x 120mm x 25mm
  • Weight: 780g (with fan)
  • Rated Voltage: 12V DC
  • Fan Speed: 800-1500RPM
  • Noise Level: 19.6-26.4 dBA
  • Bearing type: rifle
  • Life Expectancy: 40,000 hours
  • Connector: 4 pin with PWM
• Heatsink Dimensions: (L) 63 x (W) 120 x (H) 165mm
• Includes 120mm Fan with rubber connectors, Mounting Hardware, and Generic Thermal Compound

About the company: OCZ Technology

Entering the memory market in August 2000, OCZ Technology was built around the determination to manufacture the best high speed DDR and RDRAM. OCZ was founded by enthusiasts, for enthusiasts, and their commitment to the end-user has not digressed. OCZ Technology has been an innovator in many areas.

We were the first manufacturer to make Dual Channel optimized memory available to the public, which originally took advantage of nVidia's Twinbank or Dual DDR architecture, found in their nForce chipset. We have now taken that technology and tailored it for the Canterwood, and Granite Bay chipset's. OCZ developed and was the first to implement ULN technology, which has been a critical element in the manufacturing process for some time.

We at OCZ diligently work to improve communication with CPU and motherboard chipset manufacturers prior to the release of their products. Only in this manner can we fine-tune the memory's SPD settings, ensuring a synergistic relationship between the memory module, memory controller, and microprocessor. In today's rapidly evolving semiconductor industry, such communication is not simply research, but a necessary component of the manufacturing process.

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